Events
The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems
The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems
Event Date(s)
Monday, October 26, 2026 – Thursday, October 29, 2026
Location
San Diego Marriott Mission Valley
8757 Rio San Diego Drive
San Diego, CA 92108
United States
Time Zone
America/Los_Angeles
Join Gamma Technologies at InterPACK 2026 in San Diego to explore thermal management for high-density data centers. Gautham Ramchandran will present “Simulation-Driven Design and Scaling of Coolant Distribution Units for High-Density Data Center Applications,” focusing on the role of simulation in designing and scaling cooling systems.
Key Highlights
Coolant distribution unit design: Explore simulation-driven approaches to designing CDUs for high-density data centers.
Scaling cooling systems: Learn about the challenges of adapting CDU designs to growing cooling demands.
Industry connections: Meet researchers and engineers working across electronics packaging, thermal management, and advanced computing.